Nordson MARCH announced its new-generation RollVIA plasma system, a completely self-contained vacuum plasma system with roll-to-roll material handling for printed circuit board (PCB) manufacturing. The RollVIA incorporates vacuum and gas flow technology, process control technology, updated electrode designs, and temperature management with control of roll speed, tension, and edge guidance for uniform plasma treatment of substrates as thin as 25 microns. The RollVIA system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during production of PCBs.
Roll-to-roll processing, also known as web processing, reel-to-reel processing, or R2R, is the process of creating electronic devices on a roll of flexible plastic or metal foil. The RollVIA plasma treatment system is self-contained so that the vacuum system, plasma chamber, control electronics, and 40 kHz power supply are housed in a single enclosure. Yet the system has a 1737 x 2020 x 2323 mm (69 x 80 x 92 in) footprint and can handle and process web widths from 48 to 600 mm.
In addition to the system’s design, the RollVIA allows for vertical processing so that equal plasma treatment can be applied to both sides of the substrate. The vacuum pump down and process cycle times further add to the throughput and productivity of the system. It’s configurable with 1, 3, or 5 plasma cells to meet process requirements.